| 摘要 |
An adhesive composition and process for making the same are disclosed wherein the adhesive composition has greatly improved high temperature properties. The adhesive composition is prepared by first melt blending a polyphenylene ether resin and a low molecular weight resin, and then blending the resulting mixture with a monoalkenyl arene/conjugated diene block copolymer, tackifying resin, and optional hydrocarbon processing oil.
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