发明名称 Solderable wire lacquers
摘要 Lacquers of low viscosity at high solids content suitable for forming baked coatings on conductive wires which do not interfere with tinning and soldering of the coated wires consist essentially of a polyester of isophthalic or terephthalic acid having a hydroxyl number of 150 to 450, an isocyanate having isocyanato groups masked with epsilon -caprolactam, and of a solvent consisting essentially of at least one member of the group consisting of diacetone alcohol, lower alkyl ethers of ethylene glycol or diethylene glycols, and esters of said ethers with lower alkanoic acids, said lower alkyl having up to three carbon atoms, and said lower alkanoic acids having up to four carbon atoms.
申请公布号 US4104235(A) 申请公布日期 1978.08.01
申请号 US19760731925 申请日期 1976.10.13
申请人 CHEMISCHE FABRIK DR. WIEDEKING 发明人 OHM, KLAUS
分类号 C08G18/08;C08G18/42;C08G18/80;C09D5/25;H01B3/30;(IPC1-7):C08K5/06 主分类号 C08G18/08
代理机构 代理人
主权项
地址