| 摘要 |
PURPOSE:To obtain the ceramic body capable of low-temp. sintering and having high thermal conductivity by adding powders selected from respective powders of Si3N4, SiC, BN, and Al2O3 and a glass powder, each of which has a grain size one-half or less of the grain size of AlN powder, to the AlN powder and then subjecting the resulting powder mixture to compacting and to sintering. CONSTITUTION:One or more powders selected from respective powders of silicon nitride, silicon carbide, boron nitride, and alumina and a glass powder, each of which has a central grain size one-half or less of the central grain size of an aluminum nitride powder, are added to the aluminum nitride powder of 2-50mum central grain size. Subsequently, a proper binder is added to the above powders, and the resulting powder mixture is compacted and sintered, by which the ceramic body of aluminum nitride can be obtained. By this method, the green compact on which a wiring is previously printed by using a paste of copper, silver, etc., can be sintered together with the above material used in wiring simultaneously at a temp. not exceeding the melting point of the above material used in wiring. The resulting sintered compact has a thermal conductivity considerably higher than 3W/mK which is the thermal conductivity of the conventional alumina-glass substrate. |
