MAGNETIC BUBBLE, FIELD-ACCESS ASSEMBLY

摘要

A dual-in-line package (DIP) for a bubble memory is achieved by mounting the bubble chip in a cantilevered position in the plane of a rigid conductor arrangement which is interconnected to a DIP base. The lead track arrangement forms a rigid support for the chip fixing the chip in a position for receiving the orthogonal coils which characteristically supply the rotating field for field-access bubble operation.