| 摘要 |
<p>PURPOSE:To avert the occurrence of short-circuiting in later processes by covering the portions of a semiconductor substrate surface other than its scribing and separating regions with a photo resist film, scribing the substrate along the scribing and separating regions with a photo resist film, scribing the substrate along the scribing and separating regions and etching away the conductive contaminations deposited there and part of the substrate ends with the resist film as a mask.</p> |
