发明名称 |
Metal-bonding adhesive compositions |
摘要 |
A metal-bonding adhesive composition consisting essentially of 95 - 60% by weight, based on the total composition, of an aliphatic homopolyamide and 5 - 40% by weight, based on the total composition, of an aliphatic copolyamide, said homopolyamide being a crystalline homopolyamide having up to 14 amide groups per 100 carbon atoms, and said copolyamide consisting of 90 - 70% by weight of (1) a polyamide having up to 14 amide groups per 100 carbon atoms and 10 - 30% by weight of (2) at least one polyamide whose recurring units are different from those of said polyamide (1), and a metallic can body composed of a metal blank, both side end portions of which are bonded by the side-lap-seam interposed by a layer of said adhesive composition.
|
申请公布号 |
US4101534(A) |
申请公布日期 |
1978.07.18 |
申请号 |
US19720271409 |
申请日期 |
1972.07.13 |
申请人 |
TOYO SEIKAN KAISHA LIMITED |
发明人 |
UENO, HIROSHI;OTSUKA, SHINYA;TSUKAMOTO, TETSUO;KISHIMOTO, AKIRA |
分类号 |
B32B15/08;C08L77/00;C09J177/00;(IPC1-7):C08L77/00 |
主分类号 |
B32B15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|