发明名称 Metal-bonding adhesive compositions
摘要 A metal-bonding adhesive composition consisting essentially of 95 - 60% by weight, based on the total composition, of an aliphatic homopolyamide and 5 - 40% by weight, based on the total composition, of an aliphatic copolyamide, said homopolyamide being a crystalline homopolyamide having up to 14 amide groups per 100 carbon atoms, and said copolyamide consisting of 90 - 70% by weight of (1) a polyamide having up to 14 amide groups per 100 carbon atoms and 10 - 30% by weight of (2) at least one polyamide whose recurring units are different from those of said polyamide (1), and a metallic can body composed of a metal blank, both side end portions of which are bonded by the side-lap-seam interposed by a layer of said adhesive composition.
申请公布号 US4101534(A) 申请公布日期 1978.07.18
申请号 US19720271409 申请日期 1972.07.13
申请人 TOYO SEIKAN KAISHA LIMITED 发明人 UENO, HIROSHI;OTSUKA, SHINYA;TSUKAMOTO, TETSUO;KISHIMOTO, AKIRA
分类号 B32B15/08;C08L77/00;C09J177/00;(IPC1-7):C08L77/00 主分类号 B32B15/08
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