发明名称 |
MONOLITHISCH INTEGRIERTE HALBLEITERSCHALTUNGEN TRAGENDER MODUL |
摘要 |
METALLIZED CERAMIC AND PRINTED CIRCUIT MODULE A package assembly which combines metallized ceramic technology and printed circuit board multilayer technology. A plurality of modules on a metallized ceramic substrate have closely spaced pins, for example, on 50 mil centers or grid, are plugged into a complex high precision multilayer printed circuit carrier. The pins are staggered in height with the longer pins having a relatively wide spacing, for example, on 100 mil centers or grid. The longer pins protrude through the high precision carrier and plug into a normal relatively simple and low cost printed circuit card or planar package. |
申请公布号 |
DE2758140(A1) |
申请公布日期 |
1978.07.13 |
申请号 |
DE19772758140 |
申请日期 |
1977.12.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP. |
发明人 |
WALTER GEDNEY,RONALD;RICHARD RODITE,ROBERT |
分类号 |
H01L23/32;H01L23/50;H01L23/52;H01L23/538;H05K1/00;H05K1/02;H05K1/14;H05K1/18;H05K3/34;H05K3/36 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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