Thermosetting resin composition

摘要

A novel thermosetting resin composition consisting essentially of (a) one equivalent of a polyfunctional epoxy compound containing 10 to 80% by weight of a polyglycidyl ester of a fatty acid, (b) 1.5 to 5 equivalents of a polyfunctional isocyanate compound and (c) 0.01 to 10% by weight of a curing catalyst based on the total weight of the polyfunctional epoxy compound and the polyfunctional isocyanate compound. A cured product having excellent thermal resistance and excellent thermal shock resistance which is suitable for the molding of a large apparatus can be obtained by heating said thermosetting resin composition.