| 摘要 |
<p>PURPOSE:To obtain a pair of vacuum pincette which has the same operability as a conventional one and is able to stably transfer a wafer after it sucks it by a method wherein two or more sucking sections are provided to a handle and a switch. CONSTITUTION:In a pair of vacuum pincette which sucks and detached a semiconductor wafer 7, two or more vacuum sucking sections 3a and 3b are provided to a handle 1 and a switch 2. For instance, an arm connected to the handle 1 is made to branch off into forked arms 5a and 5b from the root of the handle 1, and sucking sections 3a and 3b provided with sucking grooves 4a and 4b respectively are provided to the tips of the arms 5a and 5b respectively. The switch 2 is provided singly, and the sucking sections 3a and 3b are made to suck at the same time by pushing down the switch 2 and a vacuum is turned OFF by stopping pushing down the switch 2. By this setup, a wafer can be sucked only when two or more sucking sections are brought into close contact with the rear of the wafer, and in this case, even if a pair of pincette of this design has a sucking section of the same size as that of a conventional one, it can transfers the wafer more stably.</p> |
