发明名称 Rotating vertical plating table
摘要 A rotating vertical plating table for electroplating workpieces having interior cylindrical surfaces. An approximately circular worktable is rotatably mounted upon a hollow body and has a central hole which connects to a tube which passes through the hollow body. Excess plating chemicals drain through the central hole and tube and are caught by a catch tray supported underneath the hollow body. The excess plating chemicals are recirculated to a plating anode. A ground plate is attached to the underside of the worktable and makes the workpiece which is attached to the worktable the plating cathode.
申请公布号 US4098664(A) 申请公布日期 1978.07.04
申请号 US19770818356 申请日期 1977.07.25
申请人 BUTLER, RICHARD E. 发明人 BUTLER, RICHARD E.
分类号 C25D7/04;C25D17/06;(IPC1-7):C25D17/06 主分类号 C25D7/04
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