摘要 |
A rotating vertical plating table for electroplating workpieces having interior cylindrical surfaces. An approximately circular worktable is rotatably mounted upon a hollow body and has a central hole which connects to a tube which passes through the hollow body. Excess plating chemicals drain through the central hole and tube and are caught by a catch tray supported underneath the hollow body. The excess plating chemicals are recirculated to a plating anode. A ground plate is attached to the underside of the worktable and makes the workpiece which is attached to the worktable the plating cathode.
|