| 摘要 |
<p>PURPOSE:To make it possible to obtain small-sized, high-density boards by letting them have resistors inside made of a Cu-Ni alloy. CONSTITUTION:Using an alloy of Ag and Pd having comparatively high electric resistivity and an atomic ratio of 1:1 or so as resistors for forming internal resistance can make the resistance stable to variations of firing conditions, etc., as each component of the alloy is in a state of solid solution. This makes it possible to form resistors inside ceramic multilayer wiring boards using wiring conductors of base metals such as Cu, etc. Accordingly, it becomes possible to obtain small-sized, high-density ceramic multilayer wiring boards easy to manufacture.</p> |
