| 摘要 |
<p>PURPOSE:To improve the tip of a lead in positional accuracy at bonding and to enable the flattening of a thinned lead by a method wherein the electrode of a semiconductor element and the tips, which are, at least, connected together through a bridge section, of the leads are connected to each other through bonding wires, and the bridge section is cut off by the irradiation with a laser beam. CONSTITUTION:A semiconductor element 5 is fixed to the center of a rectangular insulating ceramic board through a solder 6. Electrodes formed on the upper periphery of the element 5 are connected to the tips 9 of leads respectively through bonding wires 4. Then, a bridge section 7 of the tips 9 of the leads is cut off with a laser beam, and a ceramic cap 10 is bonded through a glass of low melting point to seal up the semiconductor element 5 and others. Next, a tie bar and a lead frame outer frame 8 are cut off. By this setup, a lead pattern, which is provided with leads that are thinned to deal with an element provided with many pins and excellent in evenness and positional accuracy, can be obtained.</p> |
