摘要 |
This invention relates to printed circuit board electrical circuit receptacles. One embodiment is a receptacle for receiving the connector prongs of a modular circuit component package of the so-called "dual in-line" type. Such contacts are retained by high pressure contact with the edges of its separate receptacle contact elements. Removal of the package is facilitated through operation of a movable element of the receptacle, which causes the prongs to slide laterally out of contact with the receptacle contact elements. |