| 摘要 |
A process for obtaining conductive and resistive elements in microwave circuits in which sequentially a layer of a thin film constituted by a high resistive material is deposited on an insulating substrate, a thin film of conductive material is deposited over the high resistence material, the high resistive film is removed by photoetching from areas which are to constitute resistive elements, a masking material is electrolytically grown on the areas constituting the resistive elements, a thick film of conductive material is electrolytically grown over the entire surface, a protecting material is deposited on areas to constitute conductive elements, the thick film of conductive material is removed by ionic erosion from areas unprotected in the previous step and residual protecting material is removed by differential chemical attack. |
