| 摘要 |
PURPOSE:To cause a wafer exposure surface to intersect a light axis at a right angle accurately by fixing the wafer between a reference surface support and vacuum chuck inside a projective exposure unit through a chip chuck having the groove, in which a convex inevitably produced at the semiconductor wafer circumference is fallen, provided and a ring spacer. In which a convex inevitably produced at the semiconductor wafer circumference is fallen, provided and a ring spacer. |
