| 发明名称 |
MANUFACTURE OF SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To prevent the short circuit for the internal lead wire and to increase the anti-moisture performance by having a plastic molding after coating the resin on the entire surface of the half-finished device before molding. |
| 申请公布号 |
JPS5372570(A) |
申请公布日期 |
1978.06.28 |
| 申请号 |
JP19760148888 |
申请日期 |
1976.12.10 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
BANJIYOU TOSHINOBU |
| 分类号 |
H01L23/28;H01L21/48;H01L21/56;H01L23/08;H01L23/12;H01L23/48 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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