| 摘要 |
PURPOSE:To enable a fine external appearance and high commodity electronic component element to mass-product easily by a method wherein a flection section, whose width of flection is larger than an inside diameter of breakthrough of the electronic component element formed by a lead wire, is injected and adhesives is filled between the flection section of the lead wire and the inside wall of the breakthough of the electronic component element. CONSTITUTION:A lead wire 12 forms a flection section 12 whose width (alpha) of the flection is larger than a diameter D of a breakthrough 11a of a ferrite bead 11 extending to the length (b) which is less than the length B of the ferrite bead at almost center thereof. The ratio of the diameter D of the breakthough 11a of the ferrite bead 11 to the diameter (d) of the lead 12, is designated to the value such that at least fluid adhesive 14 occurres capillarity at gap of capillary (g) through from one end aperture 16a of the breakthrough 11a formed between the inside wall of the breakthrough 11a of the ferrite bead 11 and lead wire 12 to another end aperture 16b. Thereafter, the adhesive 14 applied to the flection section 12a of the lead wire 12 comes to be drawn back and filled out completely inside the breakthough 11a of the ferrite bead 11 by capillarity. |
