发明名称 |
Circuit board or contact support - has holes in which component leads or pins are placed and subsequently dip soldered |
摘要 |
<p>The circuit board has holes arranged in a modular grid for insertion of component leads or contact pins. Leads or pins are connected by dip soldering to at least the metallised inner surface of the holes. The leads or contact pins (2) are inserted into the holes (3) only so deep, that their butt ends (10) are flush with the soldering side surface (5) of the circuit board. The depth of the bearer plate (1) is greater than the dia. of the lead-in wire or rod.</p> |
申请公布号 |
DE2657313(A1) |
申请公布日期 |
1978.06.22 |
申请号 |
DE19762657313 |
申请日期 |
1976.12.17 |
申请人 |
SIEMENS AG |
发明人 |
WIRD SPAETER GENANNT WERDEN |
分类号 |
H05K3/34;(IPC1-7):05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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