| 摘要 |
1,206,759. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. 18 July, 1968 [20 July, 1967], No. 33378/67. Heading H1K. A semiconductor device comprises a die, with electrodes at only one face, attached by a layer of adhesive plastics material at its electrodeless face to a support. Die and support are then encapsulated in plastics to have only external electrodes exposed. As shown in Fig. 1 a planar integrated circuit silicon die with an aluminium interconnection pattern and bonding pads is disposed on the mounting plate 3 of a gold plated iron-nickel-cobalt alloy lead frame 1 on a blob of a commercial impact polymerizable adhesive containing methyl-2-cyanoacrylate and pressed to set the layer to a layer 25Á thick. Aternative adhesives are silicone varnish and silver-loaded epoxide resin but these have to be heat cured at 200‹ C. After connecting the lead pattern to the bonding pads by aluminium wires 5, the assembly is precoated in a commercial resin known as DC644 and a final encapsulation of filled epoxide resin applied by transfer moulding. Diodes, transistors, and thyristors may be potted in like manner. |
