| 摘要 |
<p>1514401 Electronic component assemblies AUGAT INC 13 Feb 1976 [24 April 1975] 05771/76 Heading H1R A multilayer panelboard for high speed logic 11 comprises (Figs. 1, 2) plural dual in line arrays 12 of socket contacts 13 each having underlying wire wrap extensions 14 projecting from the opposite side of the board, which may carry any number of such arrays. One or more of the latter may contain dual in line packages 15 of integrated circuit switching logic. The board 11 comprises dielectric laminates 16, 17 represented by a conductive intermediate voltage plane 21 and carrying externally conductive ground planes 22, 23. Multiple socket contacts 13 are inserted through the board with protruding wire wrap extensions 14 interconnectible as required by wrapped wires. A dual in line integrated circuit package 15 had leads 31 inserted into the socket contacts, and end contact 26 is solder connected to voltage planes 32, 33 isolated from internal plane 21 by an etched out gap, while end contact 27 is solder connected at 35 to plane 21 also isolated by an etched out gap. Distributed capacitance between the voltage and ground planes is increased to reduce interference noise. Holes 36, 37 of the end of each array 12 enable decoupling capacitors to be interconnected between the voltage and ground planes; a lead through hole 36 being isolated from planes 22, 23 by etched out clearances and solder connected to voltage plane 29. A lead through hole 37 is connectible by solder to ground planes 22, 23. The board may be of glass epoxy with tin plated copper layers, and the socket contacts may be of brass with beryllium copper contacts all gold over nickel plated.</p> |
