| 发明名称 |
TOOL FOR BONDING LEAD WIRE |
| 摘要 |
A bonding tool for ultrasonically bonding wire leads is provided with a bonding tip having a pitted bonding surface thereby providing improved tool gripping action with respect to the lead that is being bonded. |
| 申请公布号 |
JPS5366370(A) |
申请公布日期 |
1978.06.13 |
| 申请号 |
JP19770094042 |
申请日期 |
1977.08.04 |
| 申请人 |
RCA CORP |
发明人 |
HAABEI DAU GIBUSON SHIEFUA |
| 分类号 |
B23K20/00;H01L21/60;H01L21/607 |
主分类号 |
B23K20/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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