| 发明名称 |
SINGLE IN-LINE HIGH POWER RESIN-PACKAGED SEMICONDUCTOR DEVICE HAVING AN IMPROVED HEAT DISSIPATOR |
| 摘要 |
PURPOSE:To reduce the height of radiation fin, by adjusting the location of the radiation fin, so that one end of the fin laps over the fin adapter plate and the rest of the fin laps over the resin body, and by connecting one end of the fin to the adapter plate. |
| 申请公布号 |
US4095253(A) |
申请公布日期 |
1978.06.13 |
| 申请号 |
US19760744397 |
申请日期 |
1976.11.23 |
| 申请人 |
HITACHI, LTD. |
发明人 |
YOSHIMURA, MASAYOSHI;OTSUKI, KEIZO;SHOJI, SENJI;YAMADA, TOMIO;SHIMIZU, ICHIO;ARAI, YUJI |
| 分类号 |
H01L23/28;H01L23/495;(IPC1-7):H01L23/38;H01L23/42;H01L23/44 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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