发明名称 FIXING TRAY OF SEMICONDUCTOR WAFERS
摘要 PURPOSE:To make possible firm fixing of a wafer by securing and forming a thin film such as of polyurethane or other having a plurality of hole parts opening to the placement side of the semiconductor wafer and flat surface parts onto the plane surface of the substrate.
申请公布号 JPS5364463(A) 申请公布日期 1978.06.08
申请号 JP19760139553 申请日期 1976.11.22
申请人 发明人
分类号 H01L21/673;B24B37/04;B24B37/30;H01L21/301;H01L21/302;H01L21/306 主分类号 H01L21/673
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