发明名称 |
FIXING TRAY OF SEMICONDUCTOR WAFERS |
摘要 |
PURPOSE:To make possible firm fixing of a wafer by securing and forming a thin film such as of polyurethane or other having a plurality of hole parts opening to the placement side of the semiconductor wafer and flat surface parts onto the plane surface of the substrate. |
申请公布号 |
JPS5364463(A) |
申请公布日期 |
1978.06.08 |
申请号 |
JP19760139553 |
申请日期 |
1976.11.22 |
申请人 |
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发明人 |
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分类号 |
H01L21/673;B24B37/04;B24B37/30;H01L21/301;H01L21/302;H01L21/306 |
主分类号 |
H01L21/673 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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