| 摘要 |
1318808 Semi-conductor devices SEMIKRON GESELLSCHAFT FUR GLEICHRICHTERBAU UND ELEKTRONIC mbH 4 Nov 1971 [6 Nov 1970] 51254/71 Addition to 1300334 Heading H1K A semi-conductor rectifier arrangement comprises a plurality of conductive members formed from a conductive strip 1, each member including a wafer contact portion 2, 3 and a conductor portion 21, 31, the contact portion of one member being a strip, 2, extending lengthwise of the conductive strip, the contact strip being bent out of the plane of the conductive strip at 22 to overlap the other contact portions 3 in order to hold a semi-conductor wafer therebetween. The wafer may then be soldered to its contacts, the arrangement provided with a housing, and the strip severed, at 10. In a further embodiment, a second smaller contact strip may be included between contact strip 2 and two portions 3, the second strip also being bent at its conductor to overlap another part of the contact portions 3, enabling two wafers to be held at each portion 3 allowing full wave bridge rectifiers to be constructed. Specification 1,300,334 is referred to. |
