| 摘要 |
1512981 Epoxy resin photo-sensitive materials GENERAL ELECTRIC CO 16 April 1975 [2 May 1974] 15705/75 Heading G2C [Also in Divisions B5 and C3] Photo-resists are prepared by imagewise exposure of coatings comprising (I) an epoxy resin and (II) an aromatic onium salt of N, P, As, Sb or Bi excluding diazonium salts which releases Lewis acid capable of curing I when exposed to radiant energy. Examples of II are triphenylphenacylphosphonium fluoroborate, triphenylcarboxymethyl phosphonium tetrafluoroborate, dimethyl methyl phenacylarsonium bromide, N- phenacyl pyridinium bromide, N-phenacylacridinium fluoroborate and O-(2-hydroxycyclohexyl)-2, 6-lutidinium-N-oxide fluoroborate. In Example 27 a mixture of bisphenol-A-diglycidylether, N-phenacyl pyridinium hexafluoroarsenate and 4-vinyl cyclohexene dioxide is coated on a steel plate, imagewise exposed and developed with isopropanol.
|
