| 摘要 |
<p>1512814 Printing plates CIBA-GEIGY AG 14 July 1976 [13 Aug 1975] 33678/75 Heading G2C [Also in Division C3] Photo-resists, useful for example in printed circuitry, are obtained by imagewise exposure of compositions comprising photo-polymerizable epoxy resin which contain, per average molecule, at least two photo-polymerizable groups (defined to exclude epoxy groups) and at least two 1, 2- epoxy groups, at least one of which is contained in units of Formula Typical examples have the Formula in which R is H or a C 1-12 aliphatic, aromatic, araliphatic or heterocyclic group (R may contain ethylenic unsaturation or aromaticity in conjugation with the indicated ethylenic double bond; R' is H, Cl, Br, C 1-4 alkyl or CN; R<SP>2</SP> is the residue, after removal of glycidyl groups linked through O, N or S atoms, of a polyglycidyl compound; a is an integer of at least 2. Photo-sensitizers, e,g. peroxides bis(dialkylamino)-benzophenone, a benzoyl phenol carboninol or an alkyl ether thereof, or Michler's ketone, may be used and the compositions may additionally contain a latent curing agent for epoxy resins, e.g. dicyandiamide, an aromatic polyamine, acid anhydride, polythiol, boron difluoride chelate, or a complex of a tertiary amine with boron trifluoride or trichloride, to cross-link the photo-polymerized product on heating.</p> |
