Semiconductor chip assembly using automatic process - has substrate disc absorbing water cut by diamond blade saw and using thermoplastic lacquer

摘要

The semiconductor chip assembly uses a semi-automatic process for mounting the chips on a support. Instead of the relatively expensive aluminium coated substrate, the process uses a substrate disc which absorbs a small amount of water and which can be cut with a diamond saw without damaging or causing a lot of wear to the blade. A good adhesive strength is achieved with the adhesive used. There is a high degree of dimensional stability, heat resistance and resistance against acetone and alcohol. The coefficient of thermal conductivity will balance out any thermal stresses. The substrate disc is made from separate foils of hard paper and the adhesive is a thermoplastic lacquer.