发明名称 FORMED CIRCUIT BOARD
摘要 PURPOSE: To properly position a molded circuit board by having a saw-tooth shaped rise in a wire end molding region, separating adjacent wire end pads from each other by the saw-tooth shaped rise, forming a wire receptacle groove, and receiving the wire end pads. CONSTITUTION: A wire end molding region 40 has a saw-tooth shaped rise 80 closely separated from each other, the rise 80 forms a wire receptacle groove 82 extending axially therebetween, and forms long and narrow wire end pads 48, 54, and 62 in the groove 82. The rise 80 is separated by a gap 85, and a rear and front rise parts 80a and 80b are formed across the region 50. A part of an insulation material 26 of a cable 20 is removed, and removed wire end parts 86 and 88 are positioned along the region 40. The end parts 86 and 88 are wiped along the region 40 by the rise parts 80a and 80b without using a special alignment tool, inserted into the groove 82, and can be precisely disposed relevant to the pads 48, 54, and 62.
申请公布号 JPH02244570(A) 申请公布日期 1990.09.28
申请号 JP19890332525 申请日期 1989.12.21
申请人 AMP INC 发明人 DEIIN AANORUDO PUYURUNAA;DEBITSUTO ARAN BEIBAU
分类号 H01R24/00;H01R43/00;H05K3/46 主分类号 H01R24/00
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