Printed circuit board with conducting paste filling circuit - formed in developed photopolymer layer

摘要

The printed circuit board if mfd. by depositing a photopolymer layer on top of a degreased board (without metal layer). The desired circuit configuration is then projected optically into the polymer layer. The polymer is then developed normally to give the circuit configuration on the board. A conducting viscous dispersion or paste is applied and fills the gaps (the circuit configuration) left by the developing process. The developed photopolymer is left on the finished circuit board. Method is rapid and therefore cheaper.