Cathode sputtering apparatus

摘要

Methods and apparatus for depositing a coating material on an underlying substrate are disclosed. Cathode sputtering techniques for rapidly depositing a relatively thick coating on a substrate having a complex geometry are developed. The apparatus employed includes a sputtering chamber formed between a center, post cathode and a hollow, cylindrical cathode. In one embodiment a magnetic field is imposed upon the sputtering chamber to concentrate the sputtered coating material in a preferred region.