| 摘要 |
<p>Ceramic prods. are metallised by the selective deposition of metal powder on a ceramic substrate, then exposing the metal to a binder (1) and heat to obtain a eutectic melt of metal and binder, where most of the metal remains solid but is wetted by the melt which also wets the substrate, forming a direct bond between metal and substrate on cooling. The powder is pref. size 1 um mixed with an organic binder (2) and solvent, esp. a methacrylate resin and pine oil, which are eliminated by heating after using serigraphy to apply the mist. The substrate is pref. BeO or Al2O3 printed with a mixt. contg. Cu powder to obtain a layer 0.025-0.05 mm thick, which is heated to 1065-1083 degrees C. in oxygen which is binder (1) and forms a eutectic with the Cu. alternatively, copper oxide can be mixed with Cu powder, which is pref. tough pitch electrolytic Cu. A layer of copper oxide may be applied to the Cu film, esp. by heating in air. The final film of Cu only contains a small amt. of oxide (1). Avoids all the difficulties involved with the conventional processes used to metallise ceramic.</p> |
