发明名称 VERFAHREN ZUM ZUSAMMENBAU UND ZUM ELEKTRISCHEN ZUSAMMEN SCHALTEN VON GEDRUCKTEN LEITERPLATTEN
摘要 1,026,984. Soldering. SPERRY RAND CORPORATION. Aug. 28, 1963 [Dec. 10, 1962], No. 34035/63. Heading B3R. [Also in Division H1] In electrically interconnecting printed circuit cards having apertures arranged in a pattern and provided with conductive linings to which printed conductors are attached, the boards are stacked with apertures aligned and with solder in the apertures, an interconnecting member is placed adjacent at least one series of the apertures, the solder is melted in an oil bath and the interconnecting member is urged into the one series of apertures so that on cooling the member is soldered to the aperture linings. Cards comprising an insulating support of epoxy resin or ceramic are provided with etched gold-plated copper conductors on one surface and tapered conductively lined apertures therethrough, the apertures being surrounded by metal rings preferably integral with the linings which may be plated-through holes formed at the same time as the rings and conductors. A photo-sensitive solder resist layer is provided on the circuit bearing surface and conductors and the card is immersed in a flux. The card is then heated and immersed in molten 60% tin, 40% lead solder to provide solder slugs in the apertures. The printed circuit cards 42, 44, 46 are stacked with glass rod spacers 52 therebetween and sandwiched between similarly apertured guide cards 50, 51 and a cover card 48 similar to the printed circuit cards but without the conductors. The assembly is held in a clamp comprising a base 60, a cover 62 and screws 64-a pair of solder coated berryliumcopper or phosphor bronze comb-like members 54, 54<SP>1</SP> with projections 56, 56<SP>1</SP> are provided by stamping or etching and the clamped assembly and the combs are positioned in an oil bath at 120-150‹ F. which is then heated to 410‹ F. to melt the solder in the apertures. The projections 56, 56<SP>1</SP> are then urged into the aperture and the oil bath is allowed to cool when the assembly is removed and washed. The bridge portions of the combs are removed, the guide cards are removed and portions of the projections beyond the cover card 48, the rings and displaced solder are ground away. Solder extends between the printed circuit cards. The circuit stack may be potted with epoxy resin and a connector is attached to each projection. The apertures may be cylindrical when conductors may be provided on both sides of a support and the conductive linings may be held frictionally in position.
申请公布号 DE1490492(B2) 申请公布日期 1971.07.22
申请号 DE19631490492 申请日期 1963.11.30
申请人 发明人
分类号 H01R4/00;H01R12/52;H05K1/02;H05K1/14;H05K3/34;H05K3/36;H05K3/40;H05K3/46;(IPC1-7):05K/ 主分类号 H01R4/00
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