| 摘要 |
A flat surface of a planar power semiconductive element, such as a thyristor or diode, is adjustably urged downwardly against a heat sink in electrical and thermal contact therewith by means of a spring-loaded eccentric element. The spring extends transversely over the opposite surface of the semiconductive element between a pair of anchor members carried by the heat sink. The eccentric is secured to an intermediate portion of the transversely extending spring, and is adapted to rotate in a vertical plane whereby successive portions of the eccentric periphery are urged with different pressures downwardly against the opposed surface of the semiconductive element, either directly or through an insulating spacer element. If desired, a pair of flattened abutment areas may be established on diametrically opposed portions of the eccentric periphery to correspondingly define a two-position stable adjustment of the bearing pressure. |
