| 发明名称 |
HEAT CURABLE ORGANOPOLYSILOXANE COMPOSITIONS |
| 摘要 |
There is disclosed heat curable organopolysiloxane compositions which contain adhesion additives which are organosilicon compounds which contain an epoxy functional group and at least one alkyl group or low molecular weight alkenyl group or hydrogen atom bound to silicon. |
| 申请公布号 |
AU1921176(A) |
申请公布日期 |
1978.05.11 |
| 申请号 |
AU19760019211 |
申请日期 |
1976.11.01 |
| 申请人 |
TORAY SILICONE COMPANY, LTD. |
发明人 |
KATSUTOSHI MINE;MINORU NISHIO;SHINICHI SUMIMURA |
| 分类号 |
C09K3/10;C08K5/14;C08L83/00;C08L83/04;C09J183/00 |
主分类号 |
C09K3/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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