| 摘要 |
PURPOSE:To absorb an instantaneous surge voltage generated by a human body, production equipment, etc., and protect a semiconductor chip from application of a high voltage by a method wherein the bottom electrode of the semiconductor chip is mounted on a dielectric heatsink attached to a mounting post and the heatsink is provided electrically in parallel with the semiconductor chip. CONSTITUTION:A package 4 which has a first lead 4c jointed to the bottom of a conductive base 4b, a second lead 4d which is inserted into a through-hole drilled in the base 4b and isolated from and fixed to the base 4b with insulating sealing glass 7 and a mounting post 4a provided on the base 4b, a dielectric heatsink 2 attached to the mounting post 4a, a conductor layer 3a provided on the surface of the heatsink 2 opposite to the mounting post 4a, a semiconductor chip 1 whose bottom electrode is mounted on the conductor layer 2a, a first bonding wire 3a with which the upper electrode of the semiconductor chip 1 is connected to the mounting post 4a and a second bonding wire 3b with which the conductor layer 2a is connected to the second lead 4d are provided. |
