| 摘要 |
1509227 Semi-conductor devices SEMIKRON GES FUR GLEICHRICHTERBAU UND ELEKTRONIK mbH 15 May 1975 [30 July 1974] 20500/75 Heading H1K In a method of applying a protective layer 4 to cover the edge surfaces of semi-conductor wafers 3 where at least one PN junction emerges, a plurality of wafers are adhered to raised portions 1alpha of a metallic support 1 with a heatsoftenable plastics material 2; the layer 4 is then applied and allowed to harden, and, with the embedded wafers 3, it is removed from the support 1 by heating to soften the plastics coat 2. The layer 4 may be in a continuous band so that the wafers can receive further treatment, e.g. attachment of contacts and leads, in a production line. The coating 2 may comprise a polyethylene wax which softens at 80-150‹ C., and the layer 4 may be of silicone rubber with a dyestuff additive. After adhesion of the wafer to the raised portions 1alpha, but before application of the layer 4, the edges of the wafers are cleaned by etching. |
