发明名称 Soldering/unsoldering appts for used with printed circuit - assemblies eg memory matrices
摘要 <p>Circuits printed on the underside of a thin, flexible, transparent, insulating film are released from those on a rigid carrier below the film using a plate moveable parallel to and on one side of I.R. radiation concentration tone of an approx. hemi-ellipsoidal right section cylindrical reflector. The radiation source is placed at the nearest focus of the reflector and the film is placed at the second focus so that it lies between the source and the rigid carrier. The plate is sprung so that it removes the soldered part of teh film from the carrier on irradiation. The appts. is light and portable.</p>
申请公布号 FR2098535(A5) 申请公布日期 1972.03.10
申请号 FR19700026636 申请日期 1970.07.20
申请人 BULL GL ELECTRIC 发明人
分类号 B23K1/018;B23K3/047;H05B3/00;(IPC1-7):23K31/00;05K3/00 主分类号 B23K1/018
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