| 摘要 |
1508560 Printed circuits SIEMENS AG 6 Jan 1977 [20 Feb 1976] 0316/77 Heading H1R A circuit pattern is produced on a carrier plate by silk-screen printing a paste-like suspension of Ag and CuO powder in a liquid bonding agent, and then securing the applied material to the plate by sintering. The suspension preferably consists of at least 92% by weight of Ag and from 4 to 8 % by weight of CuO. Terminal elements may be hard soldered to the circuit pattern conductors by using a Ag-Cu eutectic solder having a melting point below the sintering temperature. |
