| 摘要 |
1507755 Semiconductor devices SIEMENS AG 13 Jan 1976 [27 Feb 1975] 1129/76 Heading H1K In a semiconductor device assembly comprising a rectifying component 22 (Fig. 2) urged by resilient means into pressure contact with a conductive portion of its housing, which is itself in pressure contact with an external connector, the pressure maintaining the former contact, e.g. via a soft solder layer, is less than that maintaining the latter. This is achieved by forming the contact surface of the housing as a truncated cone or pyramid 8, 9, urged into a mating recess 6, 7 in a bus-bar 4, 5. As shown in Fig. 1 two components 2, 3 (e.g. two diodes or a diode and a thyristor) are pressure mounted between finned D.C. bus-bars 4, 5, contact pressure being provided by springs 13, 14 acting against an internal flange 12 in an insulating spacer 11. An external lug 15 of the spacer 11 carries A.C. terminals 16, 17 and, if the component 2 is a thyristor, a control terminal 18. The assembly may constitute a bridge circuit. Preferred angles of taper for the conical contact surfaces 8, 9 are specified. |
