| 摘要 |
The present invention is directed to a tantalum chip capacitor. The invention is characterized by encapsulating an essentially conventional tantalum capacitor subassembly including a body portion, the outer surface of which comprises a cathode, an anode, and an anode lead extending therefrom, within a metallic tubular case, preferably rectangular in transverse section. The subassembly is inserted within the casing and electrical connection is effected between the cathode and the case adjacent one end. An electrical connection is effected between the anode and the other end of the case. The case is thereafter filled with a polymeric insulating material in liquid form, which is thereafter caused to harden. After the polymeric material has hardened, a band, section or groove of the case is cut away to interrupt a direct current path between the ends of the case, which function as the terminals of the capacitor, the ends being maintained in structural integrity by the hardened polymeric material.
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