MONTERINGSENHET MED VERMERORKYLD EFFEKTHALVLEDARANORDNING

摘要

A power semiconductor device is bonded between thin metallic cup members and the edges of the assembly are provided with an electrical insulator to form the necessary creepage path. Liquid metal interfaces are provided between the cup members and heat sinks to provide high thermal and electrical conductivity joints therebetween. Since the liquid metal joint transmits heat and electricity, there is no need for high pressure joints, and since it does not permit a shear stress to be transmitted from the heat sink to the thin and fragile semiconductor device-cup member assembly, then the assembly is not stressed as with a high pressure joint. The excellent thermal characteristics of the joints result in reduced steady-state thermal resistance and improved transient response of the thin assembly and liquid metal interfaces.