| 摘要 |
A dry film photosensitive resist, according to the invention, is a flexible laminated structure consisting of three layers of which the first is a transparent polymer film transmitting UV radiation and having a thickness of 5-100 mu ; the second of said layers being a light-sensitive layer having a thickness of 5-1,000 mu and comprising a combination of a carboxyl-containing polymer-thickener, a polar oligomer, and a monomeric substance having a boiling point above 200 DEG C. at 760 mm Hg; the third of the layers being a film from a polymeric substance having a thickness of 5-100 mu , the last-mentioned layer being a protective layer for the light sensitive layer and being disposed thereon. All the three layers are adhesively bonded together. The light-sensitive layer contains as the carboxyl-containing polymer thickener, a water insoluble copolymer of a monomer or a mixture of monomers having a neutral reaction with the carboxyl-containing monomer. |
