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发明名称
ETCHING METHOD OF WAFERS
摘要
申请公布号
JPS5339872(A)
申请公布日期
1978.04.12
申请号
JP19760113691
申请日期
1976.09.24
申请人
HITACHI LTD
发明人
KOYAMA HACHIROU;OOTSUKA OOSHI
分类号
H01L21/306;H01L21/302
主分类号
H01L21/306
代理机构
代理人
主权项
地址
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