| 摘要 |
PURPOSE:To prevent resin crack during a surface mounting operation by a method wherein a prepreg of a glass woven cloth impregnated with a thermoset resin is formed on a semiconductor chip and both are molded collectively. CONSTITUTION:A semiconductor chip 3 is mounted on a die pad 1, the semiconductor chip 3 and lead wires 4 are bonded by using bonding wires 5; at least one layer each of prepregs 8 of glass woven cloths impregnated with a thermoset resin are formed respectively at the upper part of the semiconductor chip 3 and at the lower part of the die pad 1, these are molded collectively. The semiconductor chip 3 after a molding operation shows a shape that it is sealed with the thermoset resin filled with the glass woven cloths. Thereby, It is possible to prevent a resin crack by resisting an explosive expansive pressure of moisture which has been absorbed at the inside of a resin package, especially at an interface between the die pad 1 and a sealing resin or its neoghborhood, even at a high temperature during a surface mounting operation.
|
