发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To reduce the force being exerted to connection part by leeting a wire extrude by a specified length in a perpendicular direction from the end of a wedge and lowering the wedge from diagonal above and performing connection in performing connection by pressing the wire to the connection part with the wedge and subjecting the wedge to ultrasonic vibrations.
申请公布号 JPS5339066(A) 申请公布日期 1978.04.10
申请号 JP19760113126 申请日期 1976.09.22
申请人 HITACHI LTD 发明人 TAKASUGI NOBUHIRO;KIYOUMASU RIYUUICHI
分类号 H01L21/60 主分类号 H01L21/60
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