| 摘要 |
PURPOSE:To cut an Si ingot at high cutting speed by setting pH of processing liquid to pH9 or more and the temperature to 30 deg.C-80 deg.C in case of alkaline processing liquid, and pH to pH6-pH3 and the temperature to 25 deg.C-65 deg.C in case of acid processing liquid. CONSTITUTION:pH of grinding powder added processing liquid 7 is set to pH9 or more in case of alkaline processing liquid and to pH6-pH3 in case of acid processing liquid and the temperature of the processing liquid is set to 30 deg.C-80 deg.C in case of alkaline processing liquid and to 25 deg.C-65 deg.C in case of acid processing liquid, and Si ingot 1 is cut with a wire saw 2. As a result, even 10-inch Si ingot 1 can be cut with the warp below 15mum or less. |
