| 发明名称 |
SECURING METHOD OF FLIP CHIPS |
| 摘要 |
PURPOSE:To prevent shorting accident or element breakdown by thermal distortion by providing a solder blocking layer in securing a flip chip. |
| 申请公布号 |
JPS5335382(A) |
申请公布日期 |
1978.04.01 |
| 申请号 |
JP19760110061 |
申请日期 |
1976.09.13 |
| 申请人 |
SANYO ELECTRIC CO;TOKYO SANYO ELECTRIC CO |
发明人 |
KAZAMI AKIRA |
| 分类号 |
H05K3/34;H01L21/58;H01L21/60 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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