| 摘要 |
<p>Composite moulding comprises a ceramic- or glass ceramic- substrate (1) covered by an adherent metal foil (2) without using any binder between the substrate and the foil. Pref. the foil is brought into direct contact with substrate, and a uniform pressure is applied on all sides (i.e. by isostatic pressing) so the foil is directly bonded to the substrate. Used e.G. in the mfr. of tubular metal film resistors, where a metal foil is bonded to its substrate by isostatic pressing without the use of high temps. The resistors are employed in the electronics industry and/or as temp. sensors.</p> |
