Cooling container for oil cooled power semiconductor component - has studs firmly connected at right angles to box bottom in oil flow path

摘要

The bottom of the thermally and/or electrically pressure contacted power semiconductor component is mounted in a cooling container. Inside the same in the flow path of the cooling oil are mounted studs (6) firmly connected with the material of the container bottom (5), to which they assume an orthogonal orientation. The studs are preferably of quadratic cross section and are so located that one diagonal of each stud is oblique to the oil flowdirection. Barriers may be used to the oil cross-section approximately at the half flow path in the cooling container. The latter typically consists of two identical halves, hermetically connected, the studs of each half mutually abutting. Alternately it may be made of one piece including the studs.