发明名称 SEALING STRUCTURE OF SEMICONDUCTOR DEVICE AND ITS PRODUCTION
摘要 PURPOSE:To improve the restriction in height owing to resin amount, increase process ability and make a device of high reliability by providing two holes on the top of a sealing case.
申请公布号 JPS5332674(A) 申请公布日期 1978.03.28
申请号 JP19760107062 申请日期 1976.09.07
申请人 SEIKO INSTR & ELECTRONICS 发明人 TOMINAGA KAZUYOSHI
分类号 H01L23/28;H01L23/04 主分类号 H01L23/28
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